Yeh, Chang-lin: search on Z-Library

The world's largest scientific articles store. 70,000,000+ articles for free.

Don't use scam websites

1

Support excitation scheme for transient analysis of JEDEC board-level drop test

Chang-Lin Yeh, Yi-Shao Lai

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 400 KB

english, 2006

2

Transient fracturing of solder joints subjected to displacement-controlled impact loads

Chang-Lin Yeh, Yi-Shao Lai

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 528 KB

english, 2006

3

Response spectra analysis for undamped structural systems subjected to half-sine impact acceleration pulses

Tsung-Yueh Tsai, Chang-Lin Yeh, Yi-Shao Lai, Rong-Sheng Chen

Journal:

Microelectronics Reliability

Year:

2007

Language:

english

File:

PDF, 512 KB

english, 2007

4

Investigations of solder joint damage potentials for board-level chip-scale packages subjected to consecutive drops

Chang-Lin Yeh, Yi-Shao Lai

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 1.30 MB

english, 2008

5

Characteristic of copper wire and transient analysis on wirebonding process

Hsiang-Chen Hsu, Wei-Yao Chang, Chang-Lin Yeh, Yi-Shao Lai

Journal:

Microelectronics Reliability

Year:

2011

Language:

english

File:

PDF, 1.52 MB

english, 2011

6

Evaluation of solder joint strengths under ball impact test

Yi-Shao Lai, Hsiao-Chuan Chang, Chang-Lin Yeh

Journal:

Microelectronics Reliability

Year:

2007

Language:

english

File:

PDF, 1.27 MB

english, 2007

7

A Study of Crack Propagation in Pb-Free Solder Joints

Caers, J.F.J.M., Zhao, X.J., Wong, E.H., Seah, S.K.W., Selvanayagam, C.S., van Driel, W.D., Owens, N., Leoni, M., Tan, L.C., Eu, P.L., Yi-Shao Lai, Chang-Lin Yeh

Journal:

IEEE Transactions on Electronics Packaging Manufacturing

Year:

2010

Language:

english

File:

PDF, 1.38 MB

english, 2010

8

Transient Submodeling Analysis for Board-Level Drop Tests of Electronic Packages

Tsai, Tsung-Yueh, Yeh, Chang-Lin, Lai, Yi-Shao, Chen, Rong-Sheng

Journal:

IEEE Transactions on Electronics Packaging Manufacturing

Year:

2007

Language:

english

File:

PDF, 2.43 MB

english, 2007

9

Insights Into Correlation Between Board-Level Drop Reliability and Package-Level Ball Impact Test Characteristics

Yeh, Chang-Lin, Lai, Yi-Shao

Journal:

IEEE Transactions on Electronics Packaging Manufacturing

Year:

2007

Language:

english

File:

PDF, 1.74 MB

english, 2007

10

Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition

Yi-Shao Lai, Ping-Feng Yang, Chang-Lin Yeh

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 215 KB

english, 2006

11

Empirical correlation between package-level ball impact test and board-level drop reliability

Chang-Lin Yeh, Yi-Shao Lai, Hsiao-Chuan Chang, Tsan-Hsien Chen

Journal:

Microelectronics Reliability

Year:

2007

Language:

english

File:

PDF, 426 KB

english, 2007

12

Transient analysis of drop responses of board-level electronic packages using response spectra incorporated with modal superposition

Chang-Lin Yeh, Tsung-Yueh Tsai, Yi-Shao Lai

Journal:

Microelectronics Reliability

Year:

2007

Language:

english

File:

PDF, 981 KB

english, 2007

13

Finite element model verification for packaged printed circuit board by experimental modal analysis

Ying-Chih Lee, Bor-Tsuen Wang, Yi-Shao Lai, Chang-Lin Yeh, Rong-Sheng Chen

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 1.61 MB

english, 2008

14

Evaluation of board-level reliability of electronic packages under consecutive drops

Chang-Lin Yeh, Yi-Shao Lai, Chin-Li Kao

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 280 KB

english, 2006

15

Transient analysis of the impact stage of wirebonding on Cu/low-K wafers

Chang-Lin Yeh, Yi-Shao Lai

Journal:

Microelectronics Reliability

Year:

2005

Language:

english

File:

PDF, 706 KB

english, 2005

16

Effects of different drop test conditions on board-level reliability of chip-scale packages

Yi-Shao Lai, Po-Chuan Yang, Chang-Lin Yeh

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 1.30 MB

english, 2008

17

Structural design optimization for board-level drop reliability of wafer-level chip-scale packages

Tsung-Yueh Tsai, Yi-Shao Lai, Chang-Lin Yeh, Rong-Sheng Chen

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 766 KB

english, 2008

18

[IEEE 2006 International Microsystems, Package, Assembly Conference Taiwan - Grand Formosa Regent, Taipei, Taiwan (2006.10.18-2006.10.20)] 2006 International Microsystems, Package, Assembly Conference Taiwan - Finite Element Analysis Procedure for Board-level Swept Sine Vibration Tests

Yeh, Chang-lin, Lai, Yi-shao, Wang, Ching-chun

Year:

2006

Language:

english

File:

PDF, 3.43 MB

english, 2006

19

[IEEE 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2009.10.21-2009.10.23)] 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference - Response prediction and verification for PCB with package due to thermal and random vibration coupling effects

Wang, Bor-Tsuen, Hsu, Fu-Xiang, Liang, Xiu-Wei, Hung, Chen-Hsiung, Lai, Yi-Shao, Yeh, Chang-Lin, Lee, Ying-Chih

Year:

2009

Language:

english

File:

PDF, 1.59 MB

english, 2009

20

[IEEE 5th Electronics Packaging Technology Conference (EPTC 2003) - Singapore (10-12 Dec. 2003)] Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) - Dynamic analysis of wirebonding process on Cu/low-K wafers

Chang-Lin Yeh,, Yi-Shao Lai,, Jenq-Dah Wu,

Year:

2003

Language:

english

File:

PDF, 317 KB

english, 2003

21

[IEEE 2008 10th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2008.12.9-2008.12.12)] 2008 10th Electronics Packaging Technology Conference - Characteristic of Heat Affected Zone for Ultra Thin Gold Wire/Copper Wire and Advanced Finite Element Wirebonding Model

Chang, Wei-Yao, Hsu, Hsiang-Chen, Fu, Shen-Li, Yeh, Chang-Lin, Lai, Yi-Shao

Year:

2008

Language:

english

File:

PDF, 4.01 MB

english, 2008

22

[IEEE Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2008.10.22-2008.10.24)] 2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference - An Investigation on Heat Affected Zone for Au Wire/Cu Wire and Advanced Finite Element Wirebonding Model

Chang, Wei-Yao, Hsu, Hsiang-Chen, Fu, Shen-Li, Lai, Yi-Shao, Yeh, Chang-Lin

Year:

2008

Language:

english

File:

PDF, 4.12 MB

english, 2008

23

[IEEE 2007 International Microsystems, Packaging, Assembly and Circuits Technology - Taipei, Taiwan (2007.10.1-2007.10.3)] 2007 International Microsystems, Packaging, Assembly and Circuits Technology - Characteristic of heat affected zone in thin gold wire and dynamic transient analysis of wire bonding for microstructure of Cu/Low-K wafer

Pei-Chieh Chin,, Chin-Yuan Hu,, Hsiang-Chen Hsu,, Shen-Li Fu,, Chang-Lin Yeh,, Yi-Shao Lai,

Year:

2007

Language:

english

File:

PDF, 896 KB

english, 2007

24

[IEEE 2007 International Conference on Electronic Materials and Packaging (EMAP 2007) - Daejeon, Korea (2007.11.19-2007.11.22)] 2007 International Conference on Electronic Materials and Packaging - Dynamic finite element analysis on underlay microstructure of Cu/low-K wafer during bonding process

Hsiang-Chen Hsu,, Wei-Yaw Chang,, Shen-Li Fu,, Chang-Lin Yeh,, Yi-Shao Lai,

Year:

2007

Language:

english

File:

PDF, 765 KB

english, 2007

25

Investigations of Board-Level Drop Reliability of Wafer-Level Chip-Scale Packages

Lai, Yi-Shao, Yeh, Chang-Lin, Wang, Ching-Chun

Journal:

Journal of Electronic Packaging

Year:

2007

Language:

english

File:

PDF, 884 KB

english, 2007

26

Design Guideline for Ball Impact Test Apparatus

Yeh, Chang-Lin, Lai, Yi-Shao

Journal:

Journal of Electronic Packaging

Year:

2007

Language:

english

File:

PDF, 1.20 MB

english, 2007

27

High-G drop impact response and failure analysis of a chip packaged printed circuit board

S.T. Jenq, H.S. Sheu, Chang-Lin Yeh, Yi-Shao Lai, Jenq-Dah Wu

Journal:

International Journal of Impact Engineering

Year:

2007

Language:

english

File:

PDF, 2.23 MB

english, 2007

28

Examination of board-level drop reliability of package-on-package stacking assemblies of different structural configurations

Yi-Shao Lai, Chang-Lin Yeh, Ching-Chun Wang

Journal:

Microelectronic Engineering

Year:

2007

Language:

english

File:

PDF, 1.56 MB

english, 2007

29

Effects of solder alloy constitutive relationships on impact force responses of package-level solder joints under ball impact test

Chang-Lin Yeh, Yi-Shao Lai

Journal:

Journal of Electronic Materials

Year:

2006

Language:

english

File:

PDF, 695 KB

english, 2006

30

Characterizations of ball impact responses of wafer-level chip-scale packages

Yi-Shao Lai, Chang-Lin Yeh, Hsiao-Chuan Chang, Chin-Li Kao

Journal:

Journal of Alloys and Compounds

Year:

2008

Language:

english

File:

PDF, 1.64 MB

english, 2008

31

[IEEE 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2011.10.19-2011.10.21)] 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Spectrum response analysis for PCB with heating ICs in different heating conditions

Wang, Bor-Tsuen, Lee, Yau-Chang, Lai, Yi-Shao, Yeh, Chang-Lin, Lee, Ying-Chih

Year:

2011

Language:

english

File:

PDF, 1.23 MB

english, 2011

32

Baculovirus vector as an avian influenza vaccine: Hemagglutinin expression and presentation augment the vaccine immunogenicity

Chen, Chi-Yuan, Lin, Shih-Yeh, Cheng, Ming-Chu, Tsai, Ching-Ping, Hung, Chang-Lin, Lo, Kai-Wei, Hwang, Yung, Hu, Yu-Chen

Journal:

Journal of Biotechnology

Year:

2013

Language:

english

File:

PDF, 796 KB

english, 2013

33

[IEEE 7th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems - Como, Italy (24-26 April 2006)] 7th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems - Impact Force Characteristics of Package-level Solder Joints Under Ball Impact Test

Chang-Lin Yeh,, Yi-Shao Lai,

Year:

2006

Language:

english

File:

PDF, 896 KB

english, 2006

34

[IEEE 2006 8th Electronics Packaging Technology Conference - Singapore (2006.12.6-2006.12.8)] 2006 8th Electronics Packaging Technology Conference - A numerical approach towards the correlation between ball impact test and drop reliability

Yeh, Chang-Lin, Lai, Yi-Shao

Year:

2006

Language:

english

File:

PDF, 318 KB

english, 2006

35

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - High speed package design and electrical performance analysis

Shu-Qiang Zhang,, Hung-Hsiang Cheng,, Yin-Guang Zheng,, Chang-Lin Yeh,

Year:

2008

Language:

english

File:

PDF, 604 KB

english, 2008

36

[IEEE 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2010.10.20-2010.10.22)] 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - A refined finite element model verification for IC packaged PCB with thermal effects

Wang, Bor-Tsuen, Liang, Xiu-Wei, Hsu, Fu-Xiang, Lai, Yi-Shao, Yeh, Chang-Lin, Lee, Ying-Chih

Year:

2010

Language:

english

File:

PDF, 400 KB

english, 2010

37

[IEEE 2008 10th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2008.12.9-2008.12.12)] 2008 10th Electronics Packaging Technology Conference - Calibration of Equivalent Finite Element Model for Packaged Printed Circuit Board by Experimental Modal Analysis

Lee, Ying-Chih, Wang, Bor-Tsuen, Lail, Yi-Shao, Yeh, Chang-Lin, Chen, Rong-Sheng

Year:

2008

Language:

english

File:

PDF, 4.98 MB

english, 2008

38

[IEEE Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) - Singapore (8-10 Dec. 2004)] Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) - Transient analysis of board-level drop response of lead-free chip-scale packages with experimental verifications

Chang-Lin Yeh,, Yi-Shao Lai,

Year:

2004

Language:

english

File:

PDF, 406 KB

english, 2004

39

[IEEE 2007 International Microsystems, Packaging, Assembly and Circuits Technology - Taipei, Taiwan (2007.10.1-2007.10.3)] 2007 International Microsystems, Packaging, Assembly and Circuits Technology - Ball impact responses of Sn-Ag-Cu solder joints doped with Ni or Ge

Yi-Shao Lai,, Hsiao-Chuan Chang,, Ying-Ta Chiu,, Chang-Lin Yeh,, Jenn-Ming Song,

Year:

2007

Language:

english

File:

PDF, 953 KB

english, 2007

40

[IEEE 2006 International Conference on Electronic Materials and Packaging - Kowloon, China (2006.12.11-2006.12.14)] 2006 International Conference on Electronic Materials and Packaging - Finite Element Analysis of Dynamic Drop Impact of Board-level Stacked-Die Packages Using Submodeling Technique

Hsu, Hsiang-Chen, Hsu, Yu-Chia, Lee, Hui-Yu, Yeh, Chang-Lin, Lai, Yi-Shao, Fu, Shen-Li

Year:

2006

Language:

english

File:

PDF, 2.02 MB

english, 2006

41

[IEEE 2005 7th Electronic Packaging Technology Conference - Singapore (07-09 Dec. 2005)] 2005 7th Electronic Packaging Technology Conference - High-G Drop Impact Response and Failure Analysis of a Chip Packaged Printed Circuit Board

Jenq, S.T., Sheu, H.S., Chang-Lin Yeh,, Yi-Shao Lai,, Jenq-Dah Wu,

Year:

2005

Language:

english

File:

PDF, 4.13 MB

english, 2005

42

[IEEE 2006 8th Electronics Packaging Technology Conference - Singapore (2006.12.6-2006.12.8)] 2006 8th Electronics Packaging Technology Conference - Application of submodeling technique to transient drop impact analysis of board-level stacked die packages

Hsu, Hsiang-chen, Hsu, Yu-chia, Lee, Hui-yu, Yeh, Chang-lin, Lai, Yi-shao

Year:

2006

Language:

english

File:

PDF, 348 KB

english, 2006

43

[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - A study of crack propagation in Pb-free solder joints under drop impact

Caers, J.F.J.M., Wong, E.H., Seah, S.K.W., Zhao, X. J., Selvanayagam, C.S., van Driel, W.D., Owens, N., Leoni, M., Tan, L.C., Eu, P.L., Yi-Shao Lai,, Chang-Lin Yeh,

Year:

2008

Language:

english

File:

PDF, 1.64 MB

english, 2008

44

[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Micro-bump bondability design guidelines for high throughput 2.5D & 3D IC assemblies

Yeh, Chang-Lin, Yeh, Yung-Yi, Kao, Jen-Chieh, Wang, Tong Hong, Lee, Chang-Chi, Tong, Ho-Ming

Year:

2013

Language:

english

File:

PDF, 1002 KB

english, 2013

45

[IEEE 2006 International Microsystems, Package, Assembly Conference Taiwan - Grand Formosa Regent, Taipei, Taiwan (2006.10.18-2006.10.20)] 2006 International Microsystems, Package, Assembly Conference Taiwan - Ball Impact Responses of Wafer-level Chip-scale Packages

Lai, Yi-shao, Chang, Hsiao-chuan, Yeh, Chang-lin

Year:

2006

Language:

english

File:

PDF, 3.48 MB

english, 2006

46

[IEEE Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems - EuroSimE 2004 - Brussels, Belgium (10-12 May 2004)] 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the - Three-dimensional stress analysis of ink marking process [electronic packaging applications]

Chang-Lin Yeh,, Yi-Shao Lai,, Yi-Hsien Lin,, Jung-Shian Yang,

Year:

2004

Language:

english

File:

PDF, 621 KB

english, 2004

47

[IEEE Thermal and Thermomechanical 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006. - San Diego, CA (May 30-June 2, 2006)] Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006. - Development of ball impact test system

Chang-Lin Yeh,, Yi-Shao Lai,

Year:

2006

Language:

english

File:

PDF, 740 KB

english, 2006

48

[IEEE 2006 8th Electronics Packaging Technology Conference - Singapore (2006.12.6-2006.12.8)] 2006 8th Electronics Packaging Technology Conference - Elastoplastic harmonic analysis of board-level swept sine vibration tests

Yeh, Chang-lin, Lai, Yi-shao

Year:

2006

Language:

english

File:

PDF, 251 KB

english, 2006

49

[IEEE 2008 10th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2008.12.9-2008.12.12)] 2008 10th Electronics Packaging Technology Conference - Thermal-Electrical Co-simulation for Wafer-level Chip Scale Package Maximum Bearing Current

Rui-Yu,, Zhang, Shu-Qiang, Yeh, Chang-Lin, Chung, Chi-Sheng, Hung, Chih-Pin

Year:

2008

Language:

english

File:

PDF, 4.22 MB

english, 2008

50

[IEEE 2007 8th International Conference on Electronic Packaging Technology - Shanghai, China (2007.08.14-2007.08.17)] 2007 8th International Conference on Electronic Packaging Technology - Mechanism and Fracturing Modes of Solder Joints Subjected to High-speed Shearing Forces

Yeh, Chang-Lin, Lai, Yi-Shao

Year:

2007

Language:

english

File:

PDF, 478 KB

english, 2007

To build up a library is to create a life. It’s never just a random collection of books.

— Carlos María Domínguez

Official channel

Z-Library Desktop Launcher

Z-Library Since 2009 support@z-lib.do

EnglishРусскийEspañolItalianoελληνικάاللغة العربيةBahasa IndonesiaBahasa Malaysiaहिन्दीDeutschFrançaisPortuguêsУкраїнськаPolski中文繁體中文日本語Tiếng ViệtAzərbaycan DiliՀայոց լեզուภาษาไทยTürk Diliქართველიবাংলাپښتوతెలుగుاردو한국어SrpskiБългарски